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  • × 5th Annual International Workshop on Materials Science and Engineerin
  • × Ultrasonic cavitation
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1 Spreading and Wetting Behaviors of Sn2.5Ag0.7Cu0.1RE0.05Ni Solder on the Surface of Cu Substrate under Ultrasonic Vibration [会议论文]

作者:Yin, Chenxiang^1;Zhang, Keke^1^2^3;Li, Shijie^1;等

关键词:Base metals;Cu substrate;...

会议举办机构:School of Materials Science and Engineering, Henan University of Science and Technology, Luoyang, China^1

会议时间:2019

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